全局替換
延攬具有積極及建設性的態度、勇於探索和創新、正直、守紀律、樂於學習的各專業人士，旨在建立世界領先的薄膜設備公司，誠邀有志成爲新一代科技及管理方面的領導者。爲中國高科技事業貢獻一己之力。
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| 2022-05-21 | Sr. Mechanical Engineering | 瀋陽 | 薪酬面議 |
職位描述：
Responsibilities
1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers
Qualifications
1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management
Preferred Qualifications
Semiconductor industry experience is not required, but a plus.
| 2022-05-21 | Sr. Mechanical Engineering | 北京 | 薪酬面議 |
職位描述：
Responsibilities
1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers
Qualifications
1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management
Preferred Qualifications
Semiconductor industry experience is not required, but a plus.
| 2022-05-21 | Sr. Mechanical Engineering | 上海 | 薪酬面議 |
職位描述：
Responsibilities
1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed – may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers
Qualifications
1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor’s degree; or 8 years and a Master’s degree; or a PhD with 5 years’ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management
Preferred Qualifications
Semiconductor industry experience is not required, but a plus.
